3D X-ray in the Chiplet Era: Automated Inspection for Detecting the Invisible and Improving the Inevitable

As chiplet integration becomes a key enabler of advanced semiconductor systems, the complexity of packaging multiple dies on a single substrate has increased significantly. In particular, the quality of solder bump interconnections—especially under fine-pitch and heterogeneous die conditions—has become a critical factor in determining final yield and long-term reliability. Defects such as Cold Joints and Head-in-Pillow (HiP) are increasingly recognized as major risks for field failures.

This presentation explores the growing role of 3D X-ray (3DX) inspection in addressing these challenges. We will demonstrate how automated 3DX systems contribute to early defect detection, process optimization, and design feedback in high-volume manufacturing. Case studies from the SMT industry, where 3DX is already mature, will be used to highlight best practices and current technical limitations. Additionally, we will discuss unique challenges in inspecting High Bandwidth Memory (HBM) packages, including radiation shielding considerations. Through these examples, we aim to show how 3DX inspection is evolving to meet the demands of next-generation semiconductor packaging.

Key Technologies Covered

• 3D X-ray Inspection (3D-Xray)

  ・Automated Detection

  ・Solder Bump Quality

  ・Yield Improvement

  ・SMT Industry Case Studies

  ・High Bandwidth Memory (HBM) protection

  ・Verification of TSV and TGV inspection