Advance Package FA with 3D X-ray to Laser FIB correlative workflow
As advanced packaging architectures evolve with increasing density and feature scaling, larger footprints are required to accommodate more components, supporting the heterogeneous integration and More-than-Moore innovations. These trends bring new challenges in inspection, failure analysis and materials characterization, necessitating advancements in analytical tools, techniques, and workflows.
This presentation discusses recent progress in two key techniques gaining prominence in advanced packaging: 3D X-ray microscopy (XRM) and laser-integrated focused ion beam scanning electron microscopy (LaserFIB). The integration of fs-laser technology enhances cross-section preparation throughput and enables site-specific analysis of buried features. Using the minimal damage, athermal material removal capabilities of the fs laser, combined with correlative technique from 3D XRM imaging, allows for precise targeting and high-throughput analysis of complex structures, including high resolution SEM imaging, EDS and EBSD.
The 3D XRM to LaserFIB correlative workflow marks a significant advancement in addressing the challenges of failure analysis in next-generation advanced packaging.
Key Technologies Covered
- Non-destructive analysis with 3D X-ray
- Fast throughput with fs laser FIB system
- Advanced packaging failure analysis
- Correlative workflow between 3D X-ray and FIB/SEM system
