Dr. Steven Lin
Global Marketing Director, Advanced Packaging Metallization, Qnity Electronics, Inc.
Steven Lin is Global Marketing Director for Advanced Packaging Metallization at Qnity Electronics, leading product strategy, marketing, and field engineering for next-generation semiconductor packaging solutions. He brings extensive experience across R&D, product development, and customer engagement from roles at Applied Materials, Corning, and TSMC.
Steven has deep expertise in advanced packaging technologies, including hybrid bonding, Fan-Out, and 3DIC, with a strong focus on thermo-mechanical reliability and design optimization. He has led cross-functional teams, delivered significant customer value, and holds over 20 U.S. patents.
He earned his Ph.D. in Mechanical Engineering and M.A. in Business Economics from University of California, Santa Barbara, CA, USA.