Mr. Jason Chuang
Global Marketing Director, Advanced Packaging Polymer, Qnity Electronics, Inc.
Jason Chuang is Global Marketing Director for Advanced Packaging Polymer Product at Qnity Electronics, leading technology strategy and industry engagement for next-generation semiconductor packaging materials. With more than 20 years of experience in semiconductor packaging and advanced materials, he previously held R&D and engineering leadership roles at TSMC and ASE, where he drove the development of advanced packaging technologies including CoWoS, Fan-Out, SiP, and 2.5D/3D IC integration.
Jason holds more than 30 U.S. patents and has contributed to industry-leading innovations in heterogeneous integration, advanced packaging processes, and AI-enabling semiconductor technologies. His current focus is on advanced materials and platform development for future 3DIC and heterogeneous integration applications.