莊博堯

Jason Chuang is Global Marketing Director for Advanced Packaging Polymer Product at Qnity Electronics, leading technology strategy and industry engagement for next-generation semiconductor packaging materials. With more than 20 years of experience in semiconductor packaging and advanced materials, he previously held R&D and engineering leadership roles at TSMC and ASE, where he drove the development of advanced packaging technologies including CoWoS, Fan-Out, SiP, and 2.5D/3D IC integration. 

Jason holds more than 30 U.S. patents and has contributed to industry-leading innovations in heterogeneous integration, advanced packaging processes, and AI-enabling semiconductor technologies. His current focus is on advanced materials and platform development for future 3DIC and heterogeneous integration applications.