Dr. C.P. Hung
Vice President, ASE Inc.
Dr. CP Hung, an IEEE Fellow, currently serves as Vice President of Corporate Research and Development at ASE, Inc. In this role, he leads the development of next-generation technologies and oversees a comprehensive portfolio of advanced solutions spanning packaging, test, and system integration across multiple ASE and USI sites.
Dr. Hung is at the forefront of advancing semiconductor packaging technologies to address the rapidly evolving demands of the AI era. His work focuses on enabling higher performance, lower latency, increased bandwidth, and enhanced power efficiency through innovative packaging architectures and integration strategies.
He holds 435 patents covering IC packaging structures, processes, substrates, and characterization technologies, and has authored more than 155 conference and journal publications.