Mr. K.C. Hsu
Vice President, Advanced Packaging Technology Development, TSMC
Mr. K.C. Hsu is Vice President of Advanced Packaging Technology Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. He possesses more than 30 years’ experience in the semiconductor industry.
Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University in 1986 and his M.S. in Technology Management from National Chiao Tung University in 1994.