Silicon Startups Stage Agenda
Discover breakthrough technologies and innovative solutions from promising semiconductor startups around the world at the Silicon Startups Stage. Startup founders and technology leaders will share their innovations, business visions, and market opportunities through a series of live presentations.
The presentation agenda is currently being finalized and will be announced soon. Please check back for the latest schedule and speaker lineup.
Agenda:
- All presentations will be conducted in English.
- The organizer reserves the right to modify or adjust the agenda. The final agenda is subject to on-site arrangements.
Session 1 - AI for Chip Design & EDA
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 2 | 14:00 - 14:10 | Leafy Lab Inc | Agentic AI for Automated Analog and Mixed-Signal Circuit Design |
| Sep. 2 | 14:10 - 14:20 | ANIAH SAS | One Platform for Tape-Out ERC: OneCheck + Amigo AI for Trusted Mixed-Signal Verification |
| Sep. 2 | 14:20 - 14:30 | SiliconMind | SiliconMind — The Chip AI Factory: Private, On-Premise AI Agents for Autonomous IC Design |
| Sep. 2 | 14:30 - 14:40 | RAAAM | Resolving the SRAM bottleneck using the highest density on-chip memory in standard CMOS |
Session 2 - Advanced Manufacturing & Process Innovation
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 2 | 14:40 - 14:50 | AlixLabs AB | Atomic Layer Etch Pitch Splitting (APS™): Cost-Effective Patterning for Advanced Semiconductor Nodes |
| Sep. 2 | 14:50 - 15:00 | Nabu Optical Systems | High speed direct-write thermal lithography |
| Sep. 2 | 15:00 - 15:10 | Ohmplus Technology Inc. | From Phased Arrays to Silicon: AI-Accelerated Array Calibration for High-Throughput RF Semiconductor Multi-Site Testing |
| Sep. 2 | 15:10 - 15:20 | Quantum NIL Corporation | A Flexible Hybrid Foundry Platform Powered by Nanoimprint Lithography |
| Sep. 2 | 16:10 - 16:20 | weeteq | Increasing tokens per Watt by 30%, without compromising efficiency |
Session 3 - Advanced Packaging, Chiplets & Heterogeneous Integration
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 2 | 15:20 - 15:30 | Elephantech Inc. | Nanotechnology for Next-Generation Semiconductor Packaging and AI Infrastructure |
| Sep. 2 | 15:30 - 15:40 | Digitho Technologies | High-Volume Direct-Write Technology for High-Density Chiplet Interconnects in Advanced Packaging. |
| Sep. 2 | 15:40 - 15:50 | SemiAI, Co., Ltd. | Agentic AI for Predictive Yield and Autonomous Fab Analytics |
| Sep. 2 | 15:50 - 16:00 | SandBox Semiconductor Incorporated | Operational AI for Semiconductor Process Development |
| Sep. 2 | 16:00 - 16:10 | Apex Microdevices | Engineered Composite Substrates for Heterogeneous Integration |
Session 4 - Silicon Photonics, Optics & Quantum
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 3 | 11:00 - 11:10 | Nicslab Ops, Inc. | Powering the Next Generation of Photonic Integrated Circuits |
| Sep. 3 | 11:10 - 11:20 | LiVe Optronics Company Limited | High-Power CW DFB Laser Chips: Enabling Silicon Photonics and Co-Packaged Optics |
| Sep. 3 | 11:20 - 11:30 | Chi3 Optics LLC | Integrated Photonics Enabling Chip-Scale Mode-Locked Lasers |
| Sep. 3 | 11:30 - 11:40 | Wave Photonics Ltd | Photonic Chips Beyond the Data Centre: Rapid Multi-Material, Multi-Wavelength Design for Quantum and Emerging Technologies |
| Sep. 3 | 11:40 - 11:50 | Quobly | Developing a scalable, cost-efficient, silicon-based quantum computer |
| Sep. 3 | 11:50 - 12:00 | Mixx Technologies, Inc | Full Stack Wafer-Level Silicon Photonics for Next-Gen AI Infrastructure |
| Sep. 3 | 14:00 - 14:10 | Solinide Photoncs AB | Microcomb-Based External Laser Sources for Co-Packaged Optics in AI Datacentre Interconnects |
| Sep. 3 | 14:10 - 14:20 | Linque GmbH | All-Optical Silicon Photonic Switching to overcome Networking Wall |
Session 5 - AI Computing & Next-Generation Semiconductor Architecture
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 3 | 14:20 - 14:30 | Vellex Computing | Ultra-low Power AI Training |
| Sep. 3 | 14:30 - 14:40 | TopoLogic Inc. | TopoLogic: High-capacity cache memory solving the cache bottleneck for L3 cache, GPU cache, buffer memory applications |
| Sep. 3 | 14:40 - 14:50 | TurboNext.ai | The Agent-First Agentic AI Inference Platform Powering the Next Era of Enterprise AI Infrastructure |
| Sep. 3 | 14:50 - 15:00 | Emisha Innovations Inc. | Emisha SoL-X |
| Sep. 3 | 15:00 - 15:10 | LENZO Inc. | The Power Wall of AI: Why New Compute Architectures Are Emerging Beyond GPUs |
| Sep. 3 | 15:10 - 15:20 | Alpenglow Tek CO., LTD | Building an Ultra-Low-Power AI SoC Platform for Micro AI |
| Sep. 3 | 15:20 - 15:30 | eNeural Technologies, Inc. | Invest in the Future with eAI-Sim: Leading the AI Edge Deployment Revolution |
| Sep. 3 | 15:30 - 15:40 | Eraytroniks Company Limited | Advanced embedded Memory IP |
| Sep. 3 | 15:40 - 15:50 | Oculi | Moving the Edge from Imaging to Vision |
Session 6 - Smart Manufacturing, Sustainability & Facility