晶片新創特區舞台 - 新創開講議程
於晶片新創特區舞台，來自全球的半導體新創團隊將分享最新技術創新、產品應用、商業模式與市場發展機會，帶來一系列精彩的現場分享，展現半導體新創的創新能量。
議程
- 所有演講將以英文進行。
- 主辦單位保留調整或變更議程之權利，最終議程以現場安排為準。
Session 1 - AI for Chip Design & EDA
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 2 | 14:00 - 14:10 | Leafy Lab Inc | Agentic AI for Automated Analog and Mixed-Signal Circuit Design |
| Sep. 2 | 14:10 - 14:20 | ANIAH SAS | One Platform for Tape-Out ERC: OneCheck + Amigo AI for Trusted Mixed-Signal Verification |
| Sep. 2 | 14:20 - 14:30 | SiliconMind | SiliconMind — The Chip AI Factory: Private, On-Premise AI Agents for Autonomous IC Design |
| Sep. 2 | 14:30 - 14:40 | RAAAM | Resolving the SRAM bottleneck using the highest density on-chip memory in standard CMOS |
Session 2 - Advanced Manufacturing & Process Innovation
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 2 | 14:40 - 14:50 | AlixLabs AB | Atomic Layer Etch Pitch Splitting (APS™): Cost-Effective Patterning for Advanced Semiconductor Nodes |
| Sep. 2 | 14:50 - 15:00 | Nabu Optical Systems | High speed direct-write thermal lithography |
| Sep. 2 | 15:00 - 15:10 | Ohmplus Technology Inc. | From Phased Arrays to Silicon: AI-Accelerated Array Calibration for High-Throughput RF Semiconductor Multi-Site Testing |
| Sep. 2 | 15:10 - 15:20 | Quantum NIL Corporation | A Flexible Hybrid Foundry Platform Powered by Nanoimprint Lithography |
| Sep. 2 | 16:10 - 16:20 | Weeteq | Increasing tokens per Watt by 30%, without compromising efficiency |
Session 3 - Advanced Packaging, Chiplets & Heterogeneous Integration
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 2 | 15:20 - 15:30 | Elephantech Inc. | Nanotechnology for Next-Generation Semiconductor Packaging and AI Infrastructure |
| Sep. 2 | 15:30 - 15:40 | Digitho Technologies | High-Volume Direct-Write Technology for High-Density Chiplet Interconnects in Advanced Packaging. |
| Sep. 2 | 15:40 - 15:50 | SemiAI, Co., Ltd. | Agentic AI for Predictive Yield and Autonomous Fab Analytics |
| Sep. 2 | 15:50 - 16:00 | SandBox Semiconductor Incorporated | Operational AI for Semiconductor Process Development |
| Sep. 2 | 16:00 - 16:10 | Apex Microdevices | Engineered Composite Substrates for Heterogeneous Integration |
Session 4 - Silicon Photonics, Optics & Quantum
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 3 | 11:00 - 11:10 | Nicslab Ops, Inc. | Powering the Next Generation of Photonic Integrated Circuits |
| Sep. 3 | 11:10 - 11:20 | LiVe Optronics Company Limited | High-Power CW DFB Laser Chips: Enabling Silicon Photonics and Co-Packaged Optics |
| Sep. 3 | 11:20 - 11:30 | Chi3 Optics LLC | Integrated Photonics Enabling Chip-Scale Mode-Locked Lasers |
| Sep. 3 | 11:30 - 11:40 | Wave Photonics Ltd | Photonic Chips Beyond the Data Centre: Rapid Multi-Material, Multi-Wavelength Design for Quantum and Emerging Technologies |
| Sep. 3 | 11:40 - 11:50 | Quobly | Developing a scalable, cost-efficient, silicon-based quantum computer |
| Sep. 3 | 11:50 - 12:00 | Mixx Technologies, Inc | Full Stack Wafer-Level Silicon Photonics for Next-Gen AI Infrastructure |
| Sep. 3 | 14:00 - 14:10 | Solinide Photoncs AB | Microcomb-Based External Laser Sources for Co-Packaged Optics in AI Datacentre Interconnects |
| Sep. 3 | 14:10 - 14:20 | Linque GmbH | All-Optical Silicon Photonic Switching to overcome Networking Wall |
Session 5 - AI Computing & Next-Generation Semiconductor Architecture
| Date | Time | Company Name | Topic |
|---|---|---|---|
| Sep. 3 | 14:20 - 14:30 | Vellex Computing | Ultra-low Power AI Training |
| Sep. 3 | 14:30 - 14:40 | TopoLogic Inc. | TopoLogic: High-capacity cache memory solving the cache bottleneck for L3 cache, GPU cache, buffer memory applications |
| Sep. 3 | 14:40 - 14:50 | TurboNext.ai | The Agent-First Agentic AI Inference Platform Powering the Next Era of Enterprise AI Infrastructure |
| Sep. 3 | 14:50 - 15:00 | Emisha Innovations Inc. | Emisha SoL-X |
| Sep. 3 | 15:00 - 15:10 | LENZO Inc. | The Power Wall of AI: Why New Compute Architectures Are Emerging Beyond GPUs |
| Sep. 3 | 15:10 - 15:20 | Alpenglow Tek CO., LTD | Building an Ultra-Low-Power AI SoC Platform for Micro AI |
| Sep. 3 | 15:20 - 15:30 | eNeural Technologies, Inc. | Invest in the Future with eAI-Sim: Leading the AI Edge Deployment Revolution |
| Sep. 3 | 15:30 - 15:40 | Eraytroniks Company Limited | Advanced embedded Memory IP |
| Sep. 3 | 15:40 - 15:50 | Oculi | Moving the Edge from Imaging to Vision |
Session 6 - Smart Manufacturing, Sustainability & Facility