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大師論壇

2026-09-02 | 上午 10:00 - 下午 5:00
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AI X Hyperscaler X Semiconductor Define the Next Era of Human Progress

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In the era where data has become the world's most valuable asset, the convergence of Cloud Computing, Artificial Intelligence, and Semiconductors is transforming the foundation of global innovation. This powerful triad is not only driving exponential growth in computing performance and energy efficiency but also redefining how industries, economies, and societies evolve in the intelligent age.

SEMICON Taiwan 2026 will open with a special Opening Keynote by Amin Vahdat, SVP & Chief Technologist of AI and Infrastructure at Google, offering Google's vision for the future of AI infrastructure and the evolving semiconductor ecosystem. Building on this vision, CEO Summit 2026 will convene global leaders across the semiconductor, cloud, and AI industries through three executive sessions - Global Ecosystem Leadership, Scaling AI Innovation, and Technology, Trust, and the Responsibility of Innovation - to explore how collaboration, technological leadership, and responsible innovation will define the next era of human progress.

The morning session, Global Ecosystem Leadership, will bring together global semiconductor leaders to discuss resilient supply chains, ecosystem collaboration, and the strategic partnerships driving the future of semiconductor innovation. The afternoon session, Scaling AI Innovation, will focus on hyperscale AI infrastructure, next-generation computing, and the technologies required to accelerate AI deployment at global scale. The summit will conclude with the executive Fireside Chat: Technology, Trust, and the Responsibility of Innovation, where industry leaders will exchange perspectives on AI governance, trusted partnerships, and the shared responsibility of shaping the future of technology.

From the cloud to the edge, from design to deployment, CEO Summit 2026 is more than a gathering of industry visionaries - it is a platform where the world's leading executives come together to shape the future through collaboration, foresight, and shared purpose. By bridging hyperscale infrastructure, semiconductor excellence, and AI innovation, we are not merely advancing technology - we are engineering the intelligence that will define the next era of human progress.

南港展覽館2館 7樓-701AB (Future Stage)
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報名費用(含稅)

立即報名

時段
SEMI 會員
非會員
超早鳥優惠
5/20 - 6/17

SEMI 會員

NT$ 6,689

非會員

NT$ 9,555
早鳥優惠
6/18 - 8/5

SEMI 會員

NT$ 7,644

非會員

NT$ 10,920
原價
8/6 - 8/30

SEMI 會員

NT$ 9,555

非會員

NT$ 13,650
現場價
8/31 - 9/4

SEMI 會員

NT$ 12,422

非會員

NT$ 17,745
學生票
不含 EMBA
需出示有效學生證
NT$ 882
單日論壇通行證
(含稅)
1日NT$ 13,755
2日NT$ 26,040
3日NT$ 36,960
4日NT$ 46,515
5日NT$ 54,915
團報優惠(使用期限至 8/19):3 位以上團體報名或報名 3 場以上論壇享 85 折優惠
*主辦單位保留調整或更改活動議程之權利,最終議程以現場安排為準。

Featured Speakers

Dr. Tien Wu

吳田玉博士

執行長, 日月光

Co-moderator

Dr. Cliff Hou

侯永清博士

理事長, 台灣半導體協會

Co-moderator

Dr. Asad Khamisy

Dr. Asad Khamisy

Senior Vice President and General Manager, Broadcom

Keynote Speaker

Mr. Alexander Gorski

Mr. Alexander Gorski

Chief Operations Officer, Infineon Technologies

Keynote Speaker

Ms. Rani Borkar

Ms. Rani Borkar

President, Azure Hardware Systems and Infrastructure, Microsoft

Keynote Speaker

Dr. Rick Tsai

蔡力行博士

副董事長暨執行長, 聯發科技

Panelist

Mr. Benjamin Hein

Mr. Benjamin Hein

Member of the Executive Board Merck KGaA and CEO Electronics, Merck KGaA

Keynote Speaker

Mr. Jon Kemp

Mr. Jon Kemp

執行長, 啟諾迪電子

Keynote Speaker

Mr. Shan-Chieh Chien

簡山傑

董事長, 欣興電子

Panelist