New Material Technology Solutions for Front end and Back end Lithography

上午 10:00 - 上午 10:20

This presentation introduces Tokyo Ohka Kogyo Co., Ltd.'s innovations in advanced EUV resists and plating resists for back-end packaging. In response to the growing demands of semiconductor miniaturization and 3D integration, the company has developed high-sensitivity, high-resolution, and low-defect EUV lithography resists through a fusion of fundamental research and applied development. These technologies enable precise patterning with high reproducibility and mass production capability, essential for next-generation devices.

For plating resists used in packaging, TOK has optimized resolution for complex high-aspect-ratio patterns and improved material interactions, enhancing process efficiency and product reliability. Additionally, the company is actively promoting PFAS-free solutions to support environmental sustainability. These innovations not only drive industry-wide progress but also contribute to reducing environmental impact, paving the way for a more sustainable future.

 

Key Technologies Covered

  • EUV Lithography Resist
  • Packaging Resist for RDL and high Cu pillar
  • Sustainability in Non PFAS material

Featured Speakers

Mr. Katsumi Ohmori

大森 克實

執行董事、開發本部長, 東京應化工業株式會社

1991, Joined the Company

2012, General Manager, Next-Generation Material Development Department

2016, Deputy Division Manager, Research and Development Division

2020, Vice President and General Manager of Research Laboratory of TOK ADVANCED MATERIALS CO., LTD.

2021, Executive Officer; Deputy Division Manager, Research and Development Division of the Company

2025, Executive Officer; Division Manager, Research and Development Division

2025, Director; Executive Officer; Division Manager, Research and Development Division (to the present)