New Material Technology Solutions for Front end and Back end Lithography

This presentation introduces Tokyo Ohka Kogyo Co., Ltd.'s innovations in advanced EUV resists and plating resists for back-end packaging. In response to the growing demands of semiconductor miniaturization and 3D integration, the company has developed high-sensitivity, high-resolution, and low-defect EUV lithography resists through a fusion of fundamental research and applied development. These technologies enable precise patterning with high reproducibility and mass production capability, essential for next-generation devices.

For plating resists used in packaging, TOK has optimized resolution for complex high-aspect-ratio patterns and improved material interactions, enhancing process efficiency and product reliability. Additionally, the company is actively promoting PFAS-free solutions to support environmental sustainability. These innovations not only drive industry-wide progress but also contribute to reducing environmental impact, paving the way for a more sustainable future.

Key Technologies Covered

• EUV Lithography Resist
• Packaging Resist for RDL and high Cu pillar
• Sustainability in Non PFAS material