From Chiplets to Al Factories: The Multiphysics Future of Advanced Packaging
Al factories are redefining the compute continuum, pushing the semiconductor industry toward unprecedented levels of compute density, memory bandwidth, power delivery, and packaging complexity. As Al superchips scale from today's advanced multi-die packages toward system-on-wafer and system-on-panel architectures, traditional package design approaches are no longer sufficient.
These systems integrate heterogeneous compute, memory, interposer, photonic, and package technologies while operating at extreme power and performance levels, making thermal, electrical, mechanical, optical, and reliability effects tightly coupled.
This keynote presents how Synopsys together with Ansys technologies enable a unified multi-die and multiphysics design methodology from exploration through implementation and signoff. It highlights integrated workflows for automated routing, EMIR, SI/PI, thermal, stress, timing signoff, including co-packaged optics simulations. The presentation also highlights the Agentic Al capabilities to move from single/multiple task orchestration to long running and fully autonomous workflows driving simulation, verification, and engineering execution at scale. The central message is clear: multi-die is becoming the architecture of Al infrastructure, and successful design now requires multiphysics integrity, workflow automation, and co-design.
Key Technologies Covered
- Electronic Design Automation
- Engineering Simulation
- Multiphysics Fusion ™M Solutions
- Multiphysics Signoff
- Workflow Automation using PyAnsys technologies
- Physics informed Al models and surrogate models
- Agentic Al workflow using Synopsys AgentEngineer™
