Powering the AI Era with 3D Integration
The journey of artificial intelligence began with Alan Turing’s 1950 "Imitation Game," a visionary attempt to define machine intelligence. Today, we are witnessing a paradigm shift: the evolution from Generative AI to Agentic AI and Physical AI. AI is no longer just generating data; it is reasoning, deciding, and acting within the physical world.
This transformation is fueled by a revolution in semiconductor technology. The demand for massive multi-modal models has made high-bandwidth, high-capacity, and energy-efficient memory the strategic backbone of the AI era. From initial data acquisition to real-time inference, the synergy between CPUs, GPUs, and next-generation storage is critical to eliminating bottlenecks and unlocking system-wide efficiency. This infrastructure is enabling a new wave of high-value services—including multi-modal reasoning engines and autonomous agents like OpenClaw and NemoClaw—that are already scaling into multi-million dollar monthly businesses.
In this keynote, we will explore the cutting-edge memory and storage solutions that are driving the next leap in AI performance and power optimization.
Key Technologies Covered
- zHBM
- zHBF
- 3D package