Keynote: The Materials Race: Scaling Advanced Packaging Substrates for Next-Gen AI Infrastructure

下午 1:35 - 下午 1:55

The scaling of AI workloads demands unprecedented bandwidth and power delivery, shifting high-performance computing innovations from monolithic to heterogeneously integrated packaging architectures. This keynote explores the latest innovations in advanced packaging substrates, demonstrating how materials science overcomes challenges in I/O scaling, signal integrity, power efficiency, mechanical integrity, and manufacturability pathways essential for scaling tomorrow’s AI infrastructure.

 

Key Technologies Covered

  • Heterogeneous integration
  • Advanced packaging
  • Packaging substrates
  • Materials science

Featured Speakers

Dr. Gang Duan

Dr. Gang Duan

Executive Vice President, Samsung Electro-Mechanics

Dr. Gang Duan is Executive Vice President at Samsung Electro-Mechanics, leading substrate application engineering and technology marketing for US customers. Previously, he was a Senior Director and Senior Principal Engineer at Intel Foundry, pioneering advanced substrate packaging technologies like EMIB, EMIB-TSV, glass substrates, and RDL PLP. A prolific innovator, Dr. Duan holds over 350 US patents (600+ worldwide) and has published more than 50 technical papers with over 5,500 citations. He earned his Ph.D. in Materials Science and his M.S. in Electrical Engineering from California Institute of Technology (Caltech).