Co-Located Exhibition Smart Manufacturing Expo Taiwan
• Autonomous Production: Deploying Edge AI and robotics to build 24/7 fully autonomous smart factories.
• Data Integration: Integrating IIoT and big data analytics to optimize yield rates and production efficiency.
• Digital Twin: Utilizing Digital Twin technology to simulate production lines, reducing resource waste and downtime.
• Compliance Benchmarks: In-depth analysis of SEMI E187/E188 standards to build internationally compliant defense lines.
• Zero Trust Architecture: Showcasing edge computing and zero-trust deployments to prevent lateral ransomware spread.
• AI Threat Detection: Utilizing AI-driven warning systems for proactive defense against next-gen cyber threats.
• Sub-nanometer Precision: Ultra-precision machining technologies supporting components for High-NA EUV equipment.
• Resilient Supply Chain: Promoting localized maintenance and critical component supply to ensure production continuity.
• Green Manufacturing: Integrating low-energy consumption processes and eco-friendly materials for ESG compliance.
• AI × Robotics Integration: Combining AI with embodied intelligent robots to enable advanced manufacturing systems.
• Autonomous Manufacturing: Evolving from automation to self-learning and real-time decision-making operations.
• Zero-Defect Precision: Achieving high accuracy and yield through AI-driven control and monitoring.
• Digital Twin & Smart Flow: Integrating physical and digital systems to optimize efficiency and production flow.
Innovation Zones
•Featured Events: Connecting students and faculty with industry through the SEMI Campus Ambassador, Professor Honor Program, and SEMICON Taiwan Guided Theme Tours.
• Workforce Development Forums: Bringing together Tech Masters and SEMI 20 Under 40 recipients to share strategic insights and firsthand career experiences.
• Global Resources: Exploring key exhibition highlights to understand semiconductor ecosystem trends and expand career possibilities.
•Premier AI Chip Design: Driving next-generation architectures for generative AI and intelligent applications.
•Advanced ASIC Evolution: From customization to performance optimization, unlocking new computing efficiency.
•Chip Manufacturing Excellence: Showcasing advanced processes for high performance and high yield.
•Edge AI Integration: Bridging cloud and edge to enable real-time intelligence at the device level.
• VC Matchmaking: Direct access to global Venture Capital (VC) and corporate strategic investors for critical funding.
• Global Pitch: Participate in the Global Startup Pitch to showcase competitiveness in AI chips and next-gen tech.
• Supply Chain Access: Deepen connections with industry leaders to accelerate commercialization and market entry.
• Quantum Computing Architectures: Exploring leading approaches including superconducting and ion trap technologies.
• AI × Quantum Integration: Combining AI with quantum computing to accelerate complex problem-solving.
• Quantum Applications: From material discovery and optimization to cybersecurity use cases.
• Ecosystem Collaboration: Connecting the semiconductor value chain to accelerate commercialization.
Country Pavilion
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View Netherlands Pavilion Details & Exhibitor List (coming soon)
View Poland Pavilion Details & Exhibitor List (coming soon)
View Sweden & Finland Pavilion Details & Exhibitor List (coming soon)
Theme Pavilion
• 3DIC Advanced Packaging Pavilion: Focusing on heterogeneous integration and HBM stacking for next-gen AI servers.
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• FOPLP Pavilion: Defining new cost-efficiency standards for mass production through panel-level packaging.
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• Semiconductor Packaging Pavilion: Covering traditional packaging transformation and SiP applications.
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• Chiplet Pavilion: Highlighting advanced packaging and heterogeneous integration, the zone showcases how chiplet-based design is accelerating innovation in AI, HPC, and next-generation systems.
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• High-Performance Testing: Showcasing the latest ATE equipment and System-Level Testing (SLT) for AI and 5G demands.
• Yield Optimization: Leveraging precision test data feedback to achieve sub-nanometer yield monitoring.
• Testing Ecosystem: Gathering global leaders in test interfaces and probe cards for comprehensive testing solutions.
• WBG Power Semiconductor Pavilion: Leading SiC and GaN innovations to maximize EV and data center energy efficiency.
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• Opto Semiconductor Pavilion: Focusing on advanced optical sensing and components for 5G/6G and autonomous driving.
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• Air Pollution Control Pavilion: Next-gen filtration technologies assisting enterprises in meeting global zero-emission standards.
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• Decarbonization Pavilion: Low-carbon transition pathways, AI energy management, and corporate carbon asset strategies.
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• Energy-Saving Management Pavilion: Showcasing high-efficiency power systems to maximize facility energy conversion rates.
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• Waste to Reduce and Recycle Pavilion: Sustainable resource recovery and circular recycling solutions for manufacturing waste.
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• Reclaimed Water Technology Pavilion: High-recovery reclaimed water systems building resilient semiconductor water supplies.
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• Infrastructure Resilience: Highly reliable power and seismic designs ensuring stable operation for AI data centers.
• Smart Facility Monitoring: Big data integration for real-time HVAC, UPW, and gas management to minimize downtime.
• Micro-contamination Control: Sub-nanometer filtration solutions for advanced wafer manufacturing and packaging cleanrooms.
• Critical Chemicals: Showcasing next-gen photoresists, CMP slurries, and specialty gases supporting High-NA EUV yield.
• Substrate Innovation: Exploring Glass Substrates and advanced organic materials for high-performance AI chip packaging.
• Sustainable Supply Chain: Developing green materials to build a low-carbon, internationally compliant supply network.
• Co-Packaged Optics (CPO): Overcoming AI compute bottlenecks with low-latency, high-bandwidth optical-electrical conversion.
• High-Speed Networking: Showcasing 800G/1.6T+ communication components for hyperscale compute clusters.
• Heterogeneous Optics: Integrating laser sources and silicon photonic chips to commercialize AI optical interconnects.