Next Generation IC Design Summit

As AI, heterogeneous integration, and emerging applications continue to reshape the semiconductor industry, IC design is entering a new era that requires closer collaboration across design, EDA, manufacturing, and system ecosystems. The Next Generation IC Design Summit brings together leading fabless companies, EDA providers, foundries, and technology innovators to explore the next generation of semiconductor design methodologies.​

The summit will focus on key challenges facing the industry over the next three years, including AI-driven design automation, DTCO/STCO methodologies, multi-physics co-design, chiplet architectures, and system-level optimization. In addition, emerging applications such as AI infrastructure, robotics, edge computing, and space electronics will be discussed to understand future design requirements.​

Through keynote presentations, technology talks, and executive panel discussions, the summit aims to foster collaboration among IC designers, EDA partners, manufacturing ecosystems, and research organizations, helping accelerate innovation and strengthen Taiwan's leadership in next-generation semiconductor design. ​

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