Mr. Srinivasa Rao Vempati
Director, A*STAR, Institute of Microelectronics, Singapore
Vempati Srinivasa Rao is the Director and Head of the Heterogeneous Integration Department at the Institute of Microelectronics (IME), Singapore. With over 20 years of experience in advanced semiconductor packaging and integration, he leads the development of next-generation technologies including fine-pitch RDL, TSV interposers, wafer-to-wafer (W2W) and chip-to-wafer (C2W) hybrid bonding for heterogeneous chiplet integration.
His research focuses on high-density fan-out packaging, 2.5D integration, and 3D chip stacking, enabling high-performance semiconductor systems. He has authored or co-authored over 80 journal and conference publications in electronic packaging.
Mr. Vempati holds a Master’s degree in Mechanical Engineering (Materials Science) from the National University of Singapore and a Bachelor’s degree in Metallurgical Engineering from NIT Warangal, India.